Copper plating

Copper is one of the ductile non-ferrous metals and has a pink color. Melting point 1083 C°. Copper plating of metal is quite popular and is used for various purposes:

1. Decorative and protective galvanic coatings that improve the adhesion of the main coating to the metal.
2. Electroplated copper plating is used when it is necessary to lap mating friction parts and reduce noise.
3. To protect steel during grouting.
4. Copper plating of parts is used for spark protection in specialized enterprises.

Methods and thicknesses of copper plating

There are two types of copper plating: electrochemical and chemical copper plating.

Copper is also applied to the plastic as an underlayer, and then, if necessary, chrome or nickel is applied to make the part have good reflective qualities.

Depending on the purpose, the thickness of the copper coating may be different.

For example:

• when using copper plating as a sublayer for gilding or silvering – 0.3-0.5 microns< /li>
• as an undercoat for multi-layer coatings requiring high anti-corrosion properties – 8-35 microns
• solder undercoat – 6-36 µm
• 9-30 microns to reduce drag.

Copper Plating Electrolytes

The following electrolytes are used for the copper plating process:

1. alkaline
2. acid electrolytes
3. ammonia
4. Cyanide electrolytes.

The latter are quite poisonous and are used extremely rarely or in special technical processes.

Sulfate electrolytes

Sulfate electrolytes are fairly simple electrolytes and coatings that fully meet the requirements of regulatory documents. This process is often called copper plating with copper sulphate.

Composition of copper plating solution with sulfate electrolytes:

• Copper vitriol/copper sulfate – 200-250 g/l
• Sulfuric acid – 50-100 g/l.

Temperature of baths without stirring – 20-250 C° / Temperature of baths with stirring – 30-400 C°.

Cathode current density without mixing – 1-2 A/dm² / Cathodic current density with mixing – 3-5a/dm².

Limeda LT Glitter.

As a rule, to obtain shiny surfaces that do not require polishing, the composition of the electrolyte additionally includes a brightener for copper plating.

Previously, molasses, saccharin or chloramine B were used as a brightening agent for various processes. Nowadays, multicomponent brightening additives are made that are suitable for different bath compositions and have proven themselves in work.

A similar additive for copper plating is a multicomponent Limeda LT glitter . It is used in weakly acidic electrolytes in the amount of 5-10 g/l.

It happens that copper is applied to aluminum (aluminum copper plating) and its alloys or titanium alloys. For this, separate electrolytes are compiled and their composition is changed according to the technical process. However, if it is necessary to obtain a brilliant finish as a result, then Limeda LT copper plating brightener is also used for such cases.

See all electroplating additives here

Technical Novokhim specialists provide the necessary advice on your technical process, conduct laboratory analysis of bath samples and recommend reagents and gloss additives to obtain the perfect galvanic coating. Get in touch!